Technical Papers |
Ref |
Title |
Company |
Author |
Subject |
Nbr Pages |
File Size |
Download File |
Year Pub. |
1 |
THERMAL CYCLING RELIABILITY ASSESSMENT OF A CERAMIC COLUMN GRID ARRAY PACKAGE FOR SPACE APPLICATIONS |
NASA JPL Jet Propulsion Laboratory |
Rajeshumi Ramesham, Ph.D. |
Assembled daisy chain CN1752 , inspected boards nondestructively, and then subjected them to thermal cycling to assess reliability in thermal environments from +125°C to -40°C |
11 |
1Mb |
PDF |
2016 |
2 |
CCGA Column Attachment |
TopLine Corporation |
Martin Hart |
CCGA Column Attachment for Absorbing Large CTE Mismatch |
7 |
1Mb |
PDF |
2015 |
3 |
Solder Columns Space Parts Working Group |
TopLine Corporation |
Martin Hart |
Solder Columns for CCGA Substrates |
15 |
1Mb |
PDF |
2014 |
4 |
Reliability of CGA/LGA/HDI Package Board/Assembly |
NASA JPL Jet Propulsion Laboratory |
Reza Ghaffarian, Ph.D. |
Test data for CGA1752, CGA1272 and CGA1517 packages. 1.0mm pitch. Plain Columns, Copper Wrap Columns and Micro-coil Spring. Visual, SEM, and thermal cycle evaluations to determine integrity of chip capacitors on package. |
44 |
5Mb |
PDF |
2013 |
5 |
Microcoil Spring interconnects for Ceramic Grid Array Integrated Circuits |
NASA - Marshal Space Flight Center |
Mark Strickland Jimmy Hester J.F. Blanche T.S. Nash |
Novel micro-coil spring interconnect for Ceramic Grid Array - CCGA to replace solder balls and traditional solder columns. |
24 |
4Mb |
PDF |
2011 |
6 |
Study of Ceramic Column Grid Array Components for Space Systems |
Northop Grumman |
Jonathan Fleisher Walter Willing |
Paper addresses using CCGA in high reliability space systems and issues of thermal mismatch between ceramic substrate and traditional PWB. |
6 |
1Mb |
PDF |
2011 |
7 |
Ceramic Column Grid Array Design and Manufacturing Rules
for Flight Hardware |
NASA Goddard Space Flight Center |
GSFC-STD-6001 |
Mounting of CCGA onto PCB to provide uniform engineering and technical requirements for processes, procedures, practices, and methods that have been endorsed as standard for NASA programs |
21 |
1Mb |
PDF |
2011 |
8 |
Reliability of High I/O High Density CCGA Interconnect Electronc Packages under Extreme Thermal Environments. |
NASA JPL Jet Propulsion Laboratory |
Rajeshumi Ramesham, Ph.D. |
CCGA1152 and CCGA1272 packages paper provides experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. |
15 |
2Mb |
PDF |
2011 |
9 |
Reliability of CCGA Under Extreme Temperature for Space Applcations |
NASA JPL Jet Propulsion Laboratory |
Rajeshumi Ramesham, Ph.D. |
Mounting of 8 Daisy Chain CCGA717 packages on PCB and evaluation under temperature cycling from -185°C to +125°C for space applcations |
9 |
4Mb |
PDF |
2010 |
10 |
Thermal Performance of Micro-Springs in Electronic Systems |
NASA Marshall Space Flight Center |
Allison Copus Reviewed by Jeff Brown |
Internship Report using 3D modeling Pro-Engineer & thermal simulation IcePro and IcePak to model comparision of Micro-coil Springs to solder balls in vacuum conditions and to characterize their thermal performance. |
7 |
1Mb |
PDF |
2009 |
11 |
Thermal Cycle Reliability Failure Mechanisms
CCGA and PBGA With and Without Corner Staking |
NASA JPL Jet Propulsion Laboratory |
Reza Ghaffarian, Ph.D. |
Comparing Plastic Ball grid array (PBGA) to CCGA560 ceramic column grid array, inspection, thermal cycle solder joint, stake. Revision of 2006 paper |
12 |
1Mb |
PDF |
2008 |
12 |
Column Grid Array Rework For High Reliability |
NASA JPL Jet Propulsion Laboratory |
Atul Mehta & Charles Bodie |
Questions and challenges: Is the reliability of the PWB adversely affected by rework. How many times can rework the same board without destroying a pad or degrading lifetime? |
11 |
6Mb |
PDF |
2008 |
13 |
Solder Column Qualification for Ceramic Column Grid Array (CCGA) |
Aeroflex |
Author not cited |
The test vehicle used in this study was a 472 pin daisy chain CCGA package. Revision of 2006 paper |
16 |
2Mb |
PDF |
2008 |
14 |
Atmel CCGA625 Mounting Evaluation |
SAAB
|
Stanley Mattsson |
Mounting and evaluation of CCGA625 daisy chain on PCB |
31 |
8Mb |
PDF |
2007 |
15 |
CCGA packages for space applications |
NASA JPL Jet Propulsion Laboratory |
Reza Ghaffarian, Ph.D. |
Commercial-off-the-shelf (COTS) CCGA560 and CCGA717 area array packaging technologies reliability study Space Shuttle and Mars Rover missions. |
19 |
3Mb |
PDF |
2006 |
16 |
Design Parameters Influencing Reliability of CCGA Assembly: A
Sensitivity Analysis |
NASA JPL Jet Propulsion Laboratory |
Reza Ghaffarian, Amaneh Tasooji, Antonio Rinaldi |
Finite Element Method (FEM) analysis has been conducted to assess
the state of the stress/strain in CCGA assembly under different thermal cycling, and to explain the different failure modes and
locations observed in JPL test assemblies. |
8 |
1Mb |
PDF |
2005 |
17 |
Comparison of X-Ray Inspection Systems of BGA/CCGA Quality Assurance and Crack Detection |
NASA JPL Jet Propulsion Laboratory |
Reza Ghaffarian, D. Mih |
Using X-Ray as an inspection tool for detecting defects and cracks in CCGA |
7 |
2Mb |
PDF |
2005 |
18 |
Reliability Testing and Data Analysis of an 1657 CCGA (Ceramic
Column Grid Array) Package with Lead-Free Solder Paste on Lead-Free PCBs (Printed Circuit Boards) |
Agilent Technologies |
Author not cited |
Comparision of CCGA1657 Pb90/Sn10 using Lead Free Solder Paste and various PC Board Finish |
25 |
.5Mb |
PDF |
2004 |
19 |
JEDEC Standard MO-158D |
JEDEC |
JEDEC JC-11 Committee |
Square CCGA Outlines |
8 |
.2Mb |
PDF |
2002 |
20 |
JEDEC Standard MO-159B |
JEDEC |
JEDEC JC-11 Committee |
Rectangular CCGA Outlines |
6 |
.3Mb |
PDF |
1999 |
21 |
Solder Column CCMD Test Report on Serial Thermal Cycle, Shook, and Vibration Tests |
Raychem |
- |
Improved temperature life cylces using copper wrapped solder columns on ceramic LCC periemter array |
28 |
12Mb |
PDF |
1987 |